福州大学机械工程学院教师刘明

通讯地址：中国福建省福州市福州地区大学新区学园路2号 机械学院 楼北403室 邮编:350116

电子邮箱：mingliu@fzu.edu.cn ； hasanzhong@163.com ；mingliuUK@gmail.com  

教育工作经历

2009/09-2012/12，美国肯塔基大学（University of Kentucky），化工与材料学院 (Department   of Chemical and Materials Engineering)，博士

2007/09-2009/08，哈尔滨工业大学，材料科学与工程学院，材料加工工程专业，硕士

2003/09-2007/08，哈尔滨工业大学，材料科学与工程学院，材料成形及控制工程专业，本科

2015/04-今，福州大学，机械工程及自动化学院，机械设计系，旗山学者

2014/04-2015/04，美国华盛顿州立大学，机械与材料学院，博士后研究员

2013/01-2013/12，法国巴黎高科矿业工程师学校材料研究所（Center   des matériaux, Mines Paris Tech, France），博士后

社会兼职

期刊审稿人：

1)Smart   Materials and Structures

2)Engineering   Fracture Mechanics

3)Materials   Science & Engineering B

4)Materials   and Design

5)Sustainable   Energy Technologies and Assessments

6)Journal   of Materials Engineering and Performance

7)Proceedings   of the iMeche, Part J: Journal of Engineering Tribology

8)Measurement   Science and Technology

9)Sensor   Review

研究领域

1）接触，摩擦和磨损2）材料变形，疲劳及断裂3）多物理场有限元分析

4）功能和复合材料5）材料力学和电学性能

6）扩散，电迁移，热迁移

7）表面分析和处理

科研成果

期刊论文：

1.Ming Liu,   Finite element analysis of lithiation-induced decohesion of a silicon thin   film adhesively bonded to a rigid substrate under potentiostatic operation, International   Journal of Solids and Structures 67-68 (2015) 263-271.

2.Ming Liu, Finite   element analysis of lithium insertion-induced expansion of a silicon thin   film on a rigid substrate under potentiostatic operation, Journal of Power Sources   257 (2015) 760-768.

3.Ming Liu, Finite   element analysis of large contact deformation of an elastic-plastic   sinusoidal asperity and a rigid flat,International Journal of Solids   and Structures 51(2014) 3642-3652.

4.Ming Liu and   Henry Proudhon, Finite element analysis of frictionless contact between a   sinusoidal asperity and a rigid plane: elastic and initially plastic   deformations, Mechanics of Materials   77 (2014)   125-141.

5.Ming Liu and   Fuqian Yang, Indentation-induced interface decohesion between a piezoelectric   film and an elastic substrate, Journal of Computational and   Theoretical Nanoscience 11 (2014) 1863-1873.

6.Ming Liu, Finite   element analysis of effects of mechanical properties on indentation-induced   interfacial delamination,Journal   of Computational and Theoretical Nanoscience 11   (2014) 1697-1706.

7.Fuqian   Yang and Ming Liu, Analysis for   the indentation with a flat indenter on an elastic-perfectly plastic thin   film,Journal   of Computational and Theoretical Nanoscience 11   (2014) 265-271.

8.Guangfeng   Zhao, Ming Liu, Zhinan An, Yang   Ren, Peter K. Liaw and Fuqian Yang, Electromechanical responses of Cu strips, Journal   of Applied Physics 113 (2013) 183521.

9.Ming Liu and   Fuqian Yang, Orientation effect on the Boussinesq indentation of a   transversely isotropic piezoelectric material,International   Journal of Solids and Structures 50 (2013)   2542-2547.

10.Ming Liu and Fuqian Yang, Three dimensional finite element simulation of   the Berkovich indentation of a transversely isotropic piezoelectric material:   effect of material orientation, Modelling   and Simulation in Materials Science and Engineering 21   (2013) 045014.

11.Cheng   Deng, Ming Liu and Pal Molian,   Nanodiamond powder compaction via laser shockwaves: Experiments and finite   element analysis, Powder Technology   239 (2013) 36-46.

12.Ming Liu and   Fuqian Yang, Effect of crystal orientation on piezoelectric response of   single-crystal piezoelectric layers,Journal of Computational and   Theoretical Nanoscience 9 (2012) 2062-2067.

13.Ming Liu and   Fuqian Yang, Finite element simulation of the   effect of electric boundary conditions on the spherical indentation of   transversely isotropic piezoelectric films, Smart Materials and Structures 21   (2012) 105020 (10pp).

14.Ming Liu and   Fuqian Yang, Finite element analysis of the   indentation-induced delamination of bi-layer structures, Journal of Computational and   Theoretical Nanoscience 9 (2012) 851-858.

15.Ming Liu and   Fuqian Yang, Finite element analysis of the   spherical indentation of transversely isotropic piezoelectric materials, Modelling   and Simulation in Materials Science and Engineering   20 (2012) 045019 (15pp).

16.Guangfeng   Zhao, Ming Liu and Fuqian Yang, The   effect of an electric current on the nanoindentation behavior of tin,Acta Materialia   60 (2012) 3773-3782.

17.Ming Liu and Fuqian Yang, Finite element   analysis of current-induced thermal stress in a conducting sphere, Journal of Electronic Materials   41 (2012) 352-361.

会议论文：

1.Ming Liu and   Fuqian Yang, Finite   element analysis of current-induced thermal stress in a tin ball, Materials Science   & Technology 2011, Columbus Ohio.

2.Ming Liu, Henry   Proudhon,  Vladislav Yastrebov, Brice   Arrazat, and Karim Inal, Finite element   analysis of the contact behavior of rough surface, 3rd International   Conference on Material Modelling incorporating the 13 European Mechanics of   Materials Conference, September 8th-11th, 2013, Warsaw,   Poland.